Whisker formation
Growth of acicular single crystals: Diffusion of zinc or copper atoms from the base material into the tin layer creates tense lattice structures in this area. The reduction of these tensions can cause the growth of needle-shaped single crystals, so-called whiskers, on the surface of the tin layer. Such whiskers can cause electrical short circuits. A nickel barrier layer can prevent such diffusion processes. (All information without guarantee)
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